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Online Resources - Troubleshooting

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Copper solutions (acid)

Defect

Typical cause

Analysis to confirm cause

Remedy

Adhesion poor

Subscribers only

Dull deposits (sometimes with a surface “dust”)

Subscribers only

Ductility (elongation) of deposit low

Subscribers only

Pitting, step or skip plating (often linked with high solution agitation)

Subscribers only

Rough deposits

Subscribers only

Thickness low because sufficient current will not pass through the solution

Subscribers only

Throwing power (ability to plate in remote areas) too low)

Subscribers only


 


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