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Metal Finishing Information Services

Online Resources - Troubleshooting

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Copper solutions (acid)


Typical cause

Analysis to confirm cause


Adhesion poor

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Dull deposits (sometimes with a surface “dust”)

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Ductility (elongation) of deposit low

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Pitting, step or skip plating (often linked with high solution agitation)

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Rough deposits

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Thickness low because sufficient current will not pass through the solution

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Throwing power (ability to plate in remote areas) too low)

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