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Online Resources - Troubleshooting

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Tin and tin:lead - Acid


Typical cause

Analysis to confirm cause


Adhesion poor

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Pitting and/or step plating (often linked with high solution agitation)

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Rough deposits

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Solderability poor.

Note: Bright acid tin/tin:lead deposits often cannot be fused or flame soldered successfully through interference by organic matter from additives occluded in the deposit.

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“Spotting” on surface after storage.

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Throwing power poor (ability to plate in remote areas)

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“Treed” deposits

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“Whisker” growth of pure tin in storage or service

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