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Finishing
Publications & Online Resources - Troubleshooting |
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Defect |
Typical cause |
Analysis to confirm cause |
Remedy |
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Adhesion poor |
Subscribers only |
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Pitting and/or step plating (often linked with high solution agitation) |
Subscribers only |
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Rough deposits |
Subscribers only |
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Solderability poor. Note: Bright acid tin/tin:lead deposits often cannot be fused or flame soldered successfully through interference by organic matter from additives occluded in the deposit. |
Subscribers only |
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“Spotting” on surface after storage. |
Subscribers only |
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Throwing power poor (ability to plate in remote areas) |
Subscribers only |
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“Treed” deposits |
Subscribers only |
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“Whisker” growth of pure tin in storage or service |
Subscribers only |
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