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Online Resources - Troubleshooting

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Electroless copper - (formaldehyde based)

Defect

Typical cause

Analysis to confirm cause

Remedy

Adhesion poor on non-conductive substrate

Subscribers only

Adhesion poor on conductive substrate (copper)

Subscribers only

Coverage poor

Subscribers only

Plating rate low (measured by the weight gain of test panels).

Deposits may be brown or "rainbow" coloured when the deposition rate is low.

Subscribers only

Plating rate high (measured by the weight gain of test panels). Deposits may be dark with evidence of roughness when the plating rate is excessive.

Subscribers only

Porous deposits

(Porosity can be identified by examining the surface of electroless copper coated material by microscope to identify minute areas where the coating is incomplete. With translucent substrates examination of one surface with light transmitted through the substrate from behind is very effective in identifying porosity).

Subscribers only

Rough deposits

Subscribers only

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