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Online Resources - Troubleshooting

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Electroless copper - (formaldehyde based)


Typical cause

Analysis to confirm cause


Adhesion poor on non-conductive substrate

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Adhesion poor on conductive substrate (copper)

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Coverage poor

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Plating rate low (measured by the weight gain of test panels).

Deposits may be brown or "rainbow" coloured when the deposition rate is low.

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Plating rate high (measured by the weight gain of test panels). Deposits may be dark with evidence of roughness when the plating rate is excessive.

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Porous deposits

(Porosity can be identified by examining the surface of electroless copper coated material by microscope to identify minute areas where the coating is incomplete. With translucent substrates examination of one surface with light transmitted through the substrate from behind is very effective in identifying porosity).

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Rough deposits

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