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Finishing
Publications & Online Resources - Troubleshooting |
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Copper solutions (acid)
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Defect |
Typical cause |
Analysis to confirm cause |
Remedy |
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Adhesion poor |
Subscribers only |
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Dull deposits (sometimes with a surface “dust”) |
Subscribers only |
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Ductility (elongation) of deposit low |
Subscribers only |
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Pitting, step or skip plating (often linked with high solution agitation) |
Subscribers only |
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Rough deposits |
Subscribers only |
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Thickness low because sufficient current will not pass through the solution |
Subscribers only |
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Throwing power (ability to plate in remote areas) too low) |
Subscribers only |
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